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DDR 标准免费下载 JESD79-3A
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
JESD79-3A
September 2007
JEDEC
STANDARD
DDR3 SDRAM Specification
(Revision of JESD79-3)
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal Counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
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delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
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any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
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No claims to be in conformance with this standard may be made unless all requirements stated in
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Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
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Published by
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This document is copyrighted by JEDEC and may not be
reproduced without permission.
Organizations may obtain permission to reproduce a limited number of copies
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JEDEC Solid State Technology Association
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or call (703) 907-7559
JEDEC Standard No. 79-3A
Contents
i
1 Scope..........................................................................................................................................1
2 DDR3 SDRAM Package Pinout and Addressing ......................................................................3
2.1 DDR3 SDRAM x4 Ballout using MO-207 (Top view: see balls through package) ...... 3
2.2 DDR3 SDRAM x8 Ballout using MO-207 (Top view: see balls through package) ..... 4
2.3 DDR3 SDRAM x16 Ballout using MO-207 (Top view: see balls through package)..... 5
2.4 Stacked / dual-die DDR3 SDRAM x4 Ballout using MO-207 (Top view: see balls through
package).............................................................................................. 6
2.5 Stacked / dual-die DDR3 SDRAM x8 Ballout using MO-207 (Top view: see balls through
package).............................................................................................. 7
2.6 Stacked / dual-die DDR3 SDRAM x16 Ballout using MO-207 (Top view: see balls through
package).............................................................................................. 8
2.7 Pinout Description..............................................................................................................9
2.8 DDR3 SDRAM Addressing.............................................................................................11
2.8.1 512Mb .....................................................................................................................11
2.8.2 1Gb ...........................................................................................................................11
2.8.3 2Gb ..........................................................................................................................11
2.8.4 4Gb ..........................................................................................................................11
2.8.5 8Gb ..........................................................................................................................12
3 Functional Description.............................................................................................................13
3.1 Simplified State Diagram.................................................................................................13
3.2 Basic Functionality...........................................................................................................14
3.3 RESET and Initialization Procedure ................................................................................15
3.3.1 Power-up Initialization Sequence.............................................................................15
3.3.2 Reset Initialization with Stable Power .....................................................................17
3.4 Register Definition ...........................................................................................................18
3.4.1 Programming the Mode Registers............................................................................18
3.4.2 Mode Register MR0 .................................................................................................18
3.4.3 Mode Register MR1 .................................................................................................22
3.4.4 Mode Register MR2 .................................................................................................25
3.4.5 Mode Register MR3 .................................................................................................27
4 DDR3 SDRAM Command Description and Operation...........................................................29
4.1 Command Truth Table .....................................................................................................29
4.2 CKE Truth Table..............................................................................................................31
4.3 No OPeration (NOP) Command ......................................................................................32
4.4 Deselect Command ..........................................................................................................32
4.5 DLL-off Mode..................................................................................................................33
4.6 DLL on/off switching procedure......................................................................................34
4.6.1 DLL “on” to DLL “off” Procedure ..........................................................................34
4.6.2 DLL “off” to DLL “on” Procedure ..........................................................................35
4.7 Input clock frequency change ..........................................................................................36
4.8 Write Leveling .................................................................................................................38
4.8.1 DRAM setting for write leveling & DRAM termination function in that mode......38
4.8.2 Procedure Description ..............................................................................................39
4.8.3 Write Leveling Mode Exit........................................................................................41
4.9 Extended Temperature Usage ..........................................................................................42
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